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Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)According to the Japan News Agency, Japan's House of Representatives is expected to pass an additional budget for fiscal year 2024 on Thursday.The Supreme People's Procuratorate issued the prescribed guidelines to strengthen the substantive examination of technical evidence in injury cases. Recently, the Supreme People's Procuratorate issued the Provisions of the People's Procuratorate on the Substantive Examination of Technical Evidence in Injury Cases (the Working Provisions) and the Guidelines on the Special Examination of Expert Opinions on the Degree of Human Injury in Injury Cases (the Special Examination Guidelines), making efforts to strengthen the substantive examination of technical evidence in injury cases and further improving the professional and standardized level of examination and handling of injury cases.

Extreme Vietnam insider: Xia Yiping still stays in the company's on-site office and is seeking financing. On the morning of the 12th, Xia Yiping, CEO of Extreme Vietnam, appeared in the company's headquarters office. Xia Yiping said that he appeared first to prove to employees that he had not run away, to tide over the difficulties with the company, and second to communicate with employees face to face. Network video shows that Xia Yiping is surrounded by many employees. The demands of employees mainly include paying social security, medical insurance and provident fund, paying wages and giving employees "N+1" compensation. Xia Yiping responded that knowing that everyone is very angry, everyone has followed us for so long, and I am very grateful. "These problems are being solved. Now I am communicating with you. If I escape, I will not come." Some employees in Vietnam confirmed this statement. "His main task at present is financing, and he is also actively contacting investors for help." Insiders revealed. (The Paper)China galaxy International lowered the target price of Yanghe shares from RMB 88.00 to RMB 84.00.SAIC: Haitong Taicang Automobile Terminal has been put into production and operation. According to the official WeChat official account news of SAIC, today, Haitong Taicang Automobile Terminal jointly built by SAIC, Shanghai Port Group and Jiangsu Port Group has been put into production and operation, with an annual throughput of 1.3 million vehicles.

Home improvement stocks continued to rise, with daily limit of Wole Home, Meike Home, Yazhen Home, Mengtian Home, Jinpai Home and Double Gun Technology, while Dinggu Set rose by over 10%, while Shangpin home delivery, Fun Sleep Technology and Wrigley Home rose by over 5%.Market news: Britain is considering the largest auction of renewable energy subsidies in history.Li Bin: Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and will test drive together. Li Bin, founder, chairman and CEO of Weilai, announced that Weibo said that Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and test drive this upcoming administrative flagship together. Li Bin said that he asked Fang Hongbo three questions, and Fang Hongbo's answer about market competition was very good: "Actively participate in involution, compare cost and efficiency, and at the same time bravely jump out of involution, don't roll on the floor, and pierce the ceiling." (Sina Technology)